DARPA is seeking collaboration that will shape the Next-Generation Microelectronics Manufacturing (NGMM) program – an effort to help usher in a new era of microchips and their future applications.
With the NGMM program, DARPA intends to pioneer revolutionary science and technology achievements that will propel the next major wave in the manufacture of high-performance microelectronics – specifically, through three-dimensional heterogeneous integration (3DHI). Given the agency’s expectation that future innovation hinges on the fusion of diverse materials, devices, and circuits through advanced packaging, 3DHI will be key to U.S. technological leadership. The foundational goal of NGMM is to achieve national-level, 3DHI-driven breakthroughs comprising novel design and engineering.